NECINA Semiconductor SIG Seminar

 

Time:       Thu. Apr 17, 6:30pm – 8:30pm

Location: Memsic Inc.

    1 Tech Dr, Suite 325, Andover MA 01810

   

Topic:     Overview: MEMS Technology and Industrial Trend

Speaker: Gary O'Brien, VP of Engineering, MemsIC
Gary O'Brien has served as our Vice President of Engineering since July 2007. Mr. O'Brien has 14 years of experience in the design and development of multiple accelerometer and pressure sensors. Mr. O'Brien joined Motorola's Sensor Products Division in Tempe, Arizona, as a mixed signal circuit design engineer in 1993. From 1993 through 2005, he designed and developed multiple pressure, acceleration and angular rate (gyroscope) sensor systems for Motorola and its recent spin-off company, Freescale Semiconductor. From 2005 until 2007, Mr. O'Brien was an assistant professor at Arizona State University. He currently holds nine issued patents in the MEMS area, in addition to having previously generated multiple automotive accelerometer and pressure sensor/ASIC designs. Mr. O'Brien received a B.S. degree in electrical engineering with honors from the Florida Institute of Technology in Melbourne, FL, in 1988. He received an M.S. degree in electrical engineering from the Georgia Institute of Technology, Atlanta in 1993, and a Ph.D. in electrical engineering from the University of Michigan, Ann Arbor in 2004.

About MEMSIC (NASDAQ: MEMS)
Headquartered in Andover, Massachusetts, MEMSIC, Inc. provides advanced semiconductor sensor and system solutions based on integrated micro electromechanical systems, or MEMS, technology and mixed signal circuit design. Its accelerometer products are used to measure tilt, shock, vibration and acceleration, and have a wide range of applications such as mobile phones, automotive safety systems and video projectors. MEMSIC combines proprietary thermal-based MEMS technology and advanced analog mixed signal processing circuitry design into a single chip using a standard complementary metal-oxide semiconductor, or CMOS, process.

After successful IPO in 2007, Memsic is well positioned to expand its business beyond thermal accelerometer. We are aggressively seeking technologies, IPs, innovative individuals and acquisition targets for further growth. Memsic will be interested in collaboration with Chinese semiconductor professionals on any good proposals/business ideas. "Bring in your ideas, and we can help!"

 

RSVP: We only have very limited seats, please RSVP by replying to Max.Ma@necina.org

 

Contact:  Yunchu.li@necina.org, Max.Ma@necina.org

 

             

For more information, please visit the following sites:

NECINA Semiconductor SIG:  http://tech.groups.yahoo.com/group/NECINA_SIG_Semiconductor/

NECINA: http://www.necina.org/