NECINA
Semiconductor SIG Seminar
Time: Thu. Apr 17,
Location: Memsic Inc.
Topic: Overview: MEMS Technology and Industrial Trend
Speaker: Gary O'Brien, VP of
Engineering, MemsIC
Gary O'Brien has served as our Vice President of Engineering since July 2007.
Mr. O'Brien has 14 years of experience in the design and development of
multiple accelerometer and pressure sensors. Mr. O'Brien joined Motorola's
Sensor Products Division in
About MEMSIC (NASDAQ: MEMS)
Headquartered in Andover, Massachusetts, MEMSIC, Inc. provides advanced
semiconductor sensor and system solutions based on integrated micro
electromechanical systems, or MEMS, technology and mixed signal circuit design.
Its accelerometer products are used to measure tilt, shock, vibration and
acceleration, and have a wide range of applications such as mobile phones,
automotive safety systems and video projectors. MEMSIC combines proprietary
thermal-based MEMS technology and advanced analog mixed signal processing
circuitry design into a single chip using a standard complementary metal-oxide
semiconductor, or CMOS, process.
After successful IPO in 2007, Memsic is well positioned to expand its business beyond thermal accelerometer. We are aggressively seeking technologies, IPs, innovative individuals and acquisition targets for further growth. Memsic will be interested in collaboration with Chinese semiconductor professionals on any good proposals/business ideas. "Bring in your ideas, and we can help!"
RSVP: We only have very limited seats, please RSVP by replying to Max.Ma@necina.org
Contact: Yunchu.li@necina.org, Max.Ma@necina.org
For more information, please visit the following sites:
NECINA Semiconductor SIG: http://tech.groups.yahoo.com/group/NECINA_SIG_Semiconductor/
NECINA: http://www.necina.org/